Lv31
230 积分 2021-09-26 加入
耐高温有机硅弹性体的制备及性能研究
3个月前
已关闭
Mechanically enhanced healable and recyclable silicone with dynamic hindered urea bond for flexible electronics
5个月前
已完结
LnIII/CuIBimetallicNanoclusterswithEnhancedNIR-IILuminescence
6个月前
已完结
ChemInform Abstract: Time-Resolved Assembly of Cluster-in-Cluster {Ag12}-in-{W76} Polyoxometalates under Supramolecular Control
3年前
已完结
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