Lv11
100 积分 2023-06-07 加入
Low thermal expansion and high mechanical properties in Cu/diamond composite through bimodal particle strategy and interface structure regulation
8天前
已完结
Microstructure and tensile properties of Cu-B/diamond composites with various diamond particle sizes
8天前
已完结
Ultra-high-performance cold plate development through topology optimization and electrochemical additive manufacturing
16天前
已完结
An interlayer strategy for co-optimizing contact thermal resistance and thermomechanical stress in hybrid indium/carbon fiber/indium thermal interface materials for large-die packages
16天前
已完结
Carpentry-inspired interfaces for improved electronic and thermal transport
18天前
已完结
Low-temperature sintering of Ag nanoparticles for high-performance thermoelectric module design
28天前
已完结
Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics
1个月前
已完结
The development of thermal interface materials
1个月前
已完结
Review of Die-Attach Materials for SiC High-Temperature Packaging
1个月前
已完结
Near-junction heat dissipation of high-power chips by copper-diamond based heat sink
1个月前
已完结
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