Lv3
378 积分 2023-06-07 加入
Wafer-Level Integration of Liquid Cooling Microchannel on CMOS Chips with Cu-Cu Low-Temperature Bonding Process
7天前
已完结
Direct preparation of diamond heat dissipation microchannel assemblies by picosecond laser
1个月前
已完结
Integrated Microfluidic Cooling of Heterogeneous HBM–GPU Package With Die Height Difference
1个月前
已完结
Reliability of In-Silicon Etched Microfluidic Cooling Systems
1个月前
已完结
A review of diamond composites for heat spreaders
1个月前
已完结
Cu/Diamond Composite Heat Spreader for Thermal Management of Advanced Electronic Devices
1个月前
已完结
Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond
1个月前
已完结
Synergetic effect enabling high thermal conductivity in Cu/diamond composite
1个月前
已完结
Three-Dimensional Printing additive manufacturing of high-thermal-conductivity diamond/SiC ceramic with complex structure for liquid cooling application
1个月前
已完结
Fully diamond-based embedded manifold microchannel heat sink: Achieving ultra-high heat flux cooling
1个月前
已完结
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