Lv11
50 积分 2023-06-07 加入
A comprehensive review of diamond/copper composites for high thermal conductivity applications
7小时前
已完结
The heterogeneous integration of electronic components
14天前
已完结
Thermal Solutions For Large Die and Package
19天前
已完结
Additive manufacturing Ti-22Al-25 Nb alloy with excellent high temperature tensile properties by electron beam powder bed fusion
1个月前
已完结
Design and performance research of integrated indirect liquid cooling system for rack server
1个月前
已完结
Experimental and numerical analysis of variable cross-section channel liquid cooling plate for server chips thermal management
1个月前
已完结
Integrated Package-to-System Thermal Solution Evolution for High-Performance 2.5D CoWoS-R Advanced Packaging Technology Development
1个月前
已完结
Thermal management of 3-D heterogeneously integrated microelectronics: challenges and future research directions
1个月前
已完结
Simultaneous enhancement of mechanical, thermal, and electrical properties in high-W-content W-Cu alloys
3个月前
已完结
Strength-ductility synergy of additively-manufactured GH3536 superalloys achieved by dual-heterostructures
4个月前
已完结
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