Lv41
414 积分 2023-06-07 加入
Three-Dimensional Printing additive manufacturing of high-thermal-conductivity diamond/SiC ceramic with complex structure for liquid cooling application
3小时前
待确认
Fully diamond-based embedded manifold microchannel heat sink: Achieving ultra-high heat flux cooling
3小时前
已完结
Diamond-integrated n-type SiC composite substrate for improved heat dissipation and current conduction
3小时前
求助中
Experimental and numerical study of CVD diamond microchannel cooling for high heat flux heterogeneous material-integrated dies
3小时前
已完结
GaN-on-diamond technology for next-generation power devices
3小时前
已完结
Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management
3小时前
已完结
Additive Laser Metal Deposition Onto Silicon for Enhanced Microelectronics Cooling
2天前
已完结
Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices
2天前
已完结
Co-designing electronics with microfluidics for more sustainable cooling
2天前
已完结
Enhancing electronic system cooling: exploring minichannel heat sink solutions
2天前
已完结
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