Lv41
450 积分 2026-07-21 加入
Polymer-Free and Dry Patterning of Wafer-Scale Two-Dimensional Semiconductors via van der Waals Delamination
1个月前
已完结
Manufacturing Chip-Scale 2D Monolayer Single Crystals through Wafer-Bonder-Assisted Transfer
1个月前
已完结
Van der Waals device integration beyond the limits of van der Waals forces using adhesive matrix transfer
1个月前
已完结
A volatile polymer stamp for large-scale, etching-free, and ultraclean transfer and assembly of two-dimensional materials and its heterostructures
1个月前
已完结
Residue-free wafer-scale direct imprinting of two-dimensional materials
1个月前
已完结
Automated processing and transfer of two-dimensional materials with robotics
1个月前
已完结
A facile approach towards Wrinkle-Free transfer of 2D-MoS2 films via hydrophilic Si3N4 substrate
1个月前
已完结
Integrated transfer of large-scale gate dielectric/2D material films for low-power devices
1个月前
已完结
Controlled Adhesion of Ice—Toward Ultraclean 2D Materials
1个月前
已完结
All Dry Transfer Processes Utilizing Au Exfoliation for Predetermined Shapes of Transition Metal Dichalcogenide
1个月前
已完结
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