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VIBRATION ANALYSIS OF WIRE AND FREQUENCY RESPONSE IN THE MODERN WIRESAW MANUFACTURING PROCESS 5天前 已完结
DEVELOPMENT OF SEQUENTIAL GRINDING-POLISHING PROCESS APPLICABLE TO LARGE-SIZE SI WAFER FINISHING 6天前 已完结
Equilibrium Elasto-Hydrodynamic Analysis in Wafer Slicing Process Using Wiresaw 15天前 已完结
Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc Lengths 23天前 已完结
Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface 23天前 已完结
Study on the temperature field in the cutting zone for machining monocrystalline silicon wafer using free abrasive multi-wire saw 29天前 已完结
Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon 1个月前 已完结
Force Modeling and Control of SiC Monocrystal Wafer Processing 1个月前 已完结
Cutting force modeling and control of single crystal silicon using wire saw velocity reciprocation 1个月前 已完结
Grinding and lapping induced surface integrity of silicon wafers and its effect on chemical mechanical polishing 1个月前 已完结

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