Lv41
426 积分 2025-09-03 加入
Plasma etching of high aspect ratio features in SiO2 using Ar/C4F8/O2 mixtures: A computational investigation
2个月前
已完结
Characterization of SiCN thin films: Experimental and theoretical investigations
4个月前
已完结
Barrier Properties of Very Thin Ta and TaN Layers Against Copper Diffusion
4个月前
已完结
Room-Temperature Bonding of Oxide Wafers by Ar-beam Surface Activation
5个月前
已完结
Integration of plasma dicing in the collective die to wafer hybrid bonding process
7个月前
已完结
A Comparison of CF4, CHF3 and C4F8 + Ar/O2 Inductively Coupled Plasmas for Dry Etching Applications
8个月前
已完结
Yield enhancement and mitigating the Si-chipping and wafer cracking in ultra-thin 20µm-thick 8- and 12-inch LSI wafer
8个月前
已完结
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