Lv4
466 积分 2025-09-03 加入
Boosting the efficiency of InGaN-based green LEDs grown on Si through buffer strain engineering
1个月前
已完结
Research progresses on epitaxy and sidewall treatment for micro-LEDs
1个月前
已完结
Plasma etching of high aspect ratio features in SiO2 using Ar/C4F8/O2 mixtures: A computational investigation
4个月前
已完结
Characterization of SiCN thin films: Experimental and theoretical investigations
6个月前
已完结
Barrier Properties of Very Thin Ta and TaN Layers Against Copper Diffusion
6个月前
已完结
Room-Temperature Bonding of Oxide Wafers by Ar-beam Surface Activation
6个月前
已完结
Integration of plasma dicing in the collective die to wafer hybrid bonding process
8个月前
已完结
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