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30 积分 2025-08-04 加入
Experimental and Numerical Investigation of Mechanical Properties of Electroplating Copper Filled in Through Silicon Vias
12小时前
待确认
Recrystallization of Electrodeposited Copper Thin Films During Annealing
18天前
已完结
Reliability Study of Critical Structural Redistribution Layers in Advanced Packaging: A Review
3个月前
已完结
Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets
3个月前
已完结
Monolithic three-dimensional tier-by-tier integration via van der Waals lamination
3个月前
已完结
Mechanically-Guided 3D Assembly for Architected Flexible Electronics
5个月前
已完结
Highly Stable and Stretchable Conductive Films through Thermal‐Radiation‐Assisted Metal Encapsulation
5个月前
已完结
Fluid Microchannel Encapsulation to Improve the Stretchability of Flexible Electronics
5个月前
已完结
An overview of additive manufacturing methods, materials, and applications for flexible structures
5个月前
已完结
CMOS‐Technology‐Enabled Flexible and Stretchable Electronics for Internet of Everything Applications
5个月前
已完结
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