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10 积分 2025-08-04 加入
Prediction method for crystal plasticity constitutive parameters in single-crystal superalloys via two-stage tiered mapping neural network based on nanoindentation
6天前
已关闭
The deep finite element method: A deep learning framework integrating the physics-informed neural networks with the finite element method
7天前
已完结
Stored energy density solution for TSV-Cu structure deformation under thermal cyclic loading based on PINN
10天前
已完结
Experimental and Numerical Investigation of Mechanical Properties of Electroplating Copper Filled in Through Silicon Vias
2个月前
已完结
Recrystallization of Electrodeposited Copper Thin Films During Annealing
2个月前
已完结
Reliability Study of Critical Structural Redistribution Layers in Advanced Packaging: A Review
5个月前
已完结
Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets
5个月前
已完结
Monolithic three-dimensional tier-by-tier integration via van der Waals lamination
6个月前
已完结
Mechanically-Guided 3D Assembly for Architected Flexible Electronics
7个月前
已完结
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