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Material survey for packaging semiconductor diode lasers
21小时前
待确认
Highly thermally conductive substrates with adjustable CTE for diode laser bar packaging
21小时前
待确认
Review of uniqueness challenge in inverse analysis of nanoindentation
4个月前
已完结
Prediction method for crystal plasticity constitutive parameters in single-crystal superalloys via two-stage tiered mapping neural network based on nanoindentation
4个月前
已关闭
The deep finite element method: A deep learning framework integrating the physics-informed neural networks with the finite element method
4个月前
已完结
Stored energy density solution for TSV-Cu structure deformation under thermal cyclic loading based on PINN
4个月前
已完结
Experimental and Numerical Investigation of Mechanical Properties of Electroplating Copper Filled in Through Silicon Vias
6个月前
已完结
Recrystallization of Electrodeposited Copper Thin Films During Annealing
7个月前
已完结
Reliability Study of Critical Structural Redistribution Layers in Advanced Packaging: A Review
9个月前
已完结
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