Lv5
1100 积分 2024-12-05 加入
Developer-soluble gap fill materials for patterning metal trenches in via-first dual-damascene process
2个月前
已完结
Characterization of metal line-width variation in via first dual-damascene approach and its modeling using machine learning artificial neural network algorithms
2个月前
已完结
A GPU-based full-chip inverse lithography solution for random patterns
3个月前
已完结
Model-based double dipole lithography for sub-30nm node device
3个月前
已完结
Mask CD control (CDC) using AIMS as the CD metrology data source
7个月前
已完结
New process models for OPC at sub-90-nm nodes
7个月前
已完结
Performance comparison of techniques for intra-field CD control improvement
7个月前
已完结
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