Lv51
890 积分 2024-12-05 加入
OPC model calibration using deep reinforcement learning
7天前
已完结
Mask process correction for optical weak pattern improvement
1个月前
已完结
SAQP and EUV block patterning of BEOL metal layers on IMEC's iN7 platform
1个月前
已完结
Source-mask co-optimization study for 7 nm metal layer patterns with 80 nm minimum pitch
1个月前
已完结
Overlay and edge placement control strategies for the 7nm node using EUV and ArF lithography
1个月前
已完结
7nm logic optical lithography with OPC-Lite
1个月前
已完结
Design rule optimization for via layers of multiple patterning solution at 7nm technology node
1个月前
已完结
The challenge of multi-patterning lithography for contact layer in 7nm and beyond (Conference Presentation)
1个月前
已关闭
Sample plan selection techniques for lithography process model building
1个月前
已完结
Your worst nightmare: inspection of aggressive OPC on 14nm masks with emphasis on defect sensitivity and wafer defect print predictability
1个月前
已完结
皖公网安备34019202002308
