Lv51
940 积分 2024-12-05 加入
Your worst nightmare: inspection of aggressive OPC on 14nm masks with emphasis on defect sensitivity and wafer defect print predictability
3小时前
已完结
Layout optimization and trade-off between 193i and EUV-based patterning for SRAM cells to improve performance and process variability at 7nm technology node
5小时前
已完结
Acceleration method for source mask optimization at 7nm technology node
5小时前
已完结
193nm mask inspection challenges and approaches for 7nm/5nm technology and beyond
5小时前
已完结
Making lithography work for the 7-nm node and beyond in overlay accuracy, resolution, defect, and cost
5小时前
已完结
Source mask optimization based on design pattern library at 7nm technology node
6小时前
已完结
Defect avoidance for EUV photomask readiness at the 7 nm node
6小时前
已完结
Design rule optimization for via layers of multiple patterning solution at 7nm technology node
6小时前
已完结
Source mask optimization based on design pattern library at 7nm technology node
6小时前
已完结
Developer-soluble gap fill materials for patterning metal trenches in via-first dual-damascene process
3个月前
已完结
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