Lv3
220 积分 2024-02-29 加入
Simulation and Experimental Validation of Microstructure Evolution of Sintered Ag Layer During Thermal Aging Using a Hybrid Potts-Phase Field Model
7小时前
求助中
A developed crystal plasticity model for viscoplastic mechanical behavior of SAC305 solder under thermomechanical coupled cyclic loading
2个月前
已完结
Review on multi-scale mechanics fundamentals and numerical methods for electronics packaging interconnect materials
2个月前
已完结
Modeling of Intergranular Mechanical Fatigue of a Sintered Nanosilver Die Attachment for Power Electronics
2个月前
已完结
Time-Efficient Sintering Processes to Attach Power Devices Using Nanosilver Dry Film
4个月前
已关闭
Coarsening, densification, and grain growth during sintering of nano-sized powders—A perspective
6个月前
已关闭
Densification mechanism and surface mechanical failure evolution of complex silver nanoparticle interconnection interface via pressure-assisted forced bonding
6个月前
已完结
Bonding Behavior and Quality of Pressureless Ag Sintering on (111)-Oriented Nanotwinned Cu Substrate in Ambient Air
6个月前
已完结
Micro-additives and their impact on tensile and fracture performance of solder
6个月前
已完结
Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and β-Sn single crystal calculations
6个月前
已完结
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