Lv3
236 积分 2024-01-16 加入
Low dielectric and thermal properties of polyimides based on PMDA, BPADA, TPE-Q and TPE-R
3个月前
已完结
Thermoplastic and low dielectric constants polyimides based on BPADA-BAPP
3个月前
已完结
Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages
6个月前
已完结
Women’s and health providers’ perceptions of companionship during labor and childbirth: a formative study for the implementation of WHO companionship model in Burkina Faso
6个月前
已完结
Low-CTE, Strong-Adhesion, and High-Resolution Photosensitive Polyimide Materials for Advanced Packaging Applications: Structure and Properties
6个月前
已完结
Super-high interface adhesion through silver/polyimide heterojunction
7个月前
已关闭
Effects of plasma treatment of polyimide on the adhesion strength of epoxy resin / polyimide j oints
7个月前
已完结
Influence of chitosan thioglycolic acid conjugate in improving bioavailability of an antiparkinson drug; Rasagiline Mesylate from transdermal patch
8个月前
已完结
Adhesion Characterization and Enhancement between Polyimide-Silica Composite and Nodulated Copper for Applications in Next-Generation Microelectronics
8个月前
已完结
A Microwave‐Strengthened Supramolecular Adhesive: from Flexible Pressure Sensitive Bonding to Strong and Muti‐Reusable Hot Melt Bonding
8个月前
已完结
皖公网安备34019202002308
