Lv11
58 积分 2025-01-09 加入
SEMICONDUCTOR WAFER BONDING
12分钟前
已完结
Finite element modeling analysis of misalignment impact on simulated electrical RC in scaling hybrid bonding pairs
1个月前
已完结
Enhanced Thermoelectric Properties in p‐Type Double Half‐Heusler Ti2−yHfyFeNiSb2−xSnx Compounds
11个月前
已完结
Harvesting waste heat with flexible Bi2Te3 thermoelectric thin film
11个月前
已完结