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146 积分 2022-09-20 加入
Stepped Disconnection‐Contributing AgRuIr Nanocrystals with Turtle Shell‐Shaped Oxide Layer for Acidic Water Oxidation
1年前
已完结
Study and characterization on the nanocomposite underfill for flip chip applications
1年前
已完结
Encapsulants used in flip-chip packages
1年前
已关闭
Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
1年前
已完结
Guinier–Preston Zones Featuring PtCu Nanocrystals: Coherency Strain Fields Reshaping the Band Structure for Oxygen Reduction Electrocatalysis
1年前
已完结
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