Lv11
38 积分 2025-06-29 加入
Energetics of the nucleation and glide of disconnection modes in symmetric tilt grain boundaries
11小时前
已完结
Void nucleation at tilt grain boundaries: Atomic-scale insights
10天前
已完结
Atomic-scale insights into electromigration in Cu interconnects via a new molecular dynamics approach
10天前
已完结
Electromigration failure in a copper dual-damascene structure with a through silicon via
10天前
已完结
Understanding Grain Boundary Electrical Resistivity in Cu: The Effect of Boundary Structure
10天前
已完结
Electromigration of vacancies in copper
11天前
已完结
The co-regulation mechanism for the indentation size effect and the interface in Nb–NiTi–Nb nano-multilayer films
12天前
已完结
Molecular dynamics simulation of shock response and spallation in NiTi–Ni multilayer films
12天前
已完结
Constrained minimal-interface structures in polycrystalline copper with extremely fine grains
23天前
已完结
A modified synthetic driving force method for molecular dynamics simulation of grain boundary migration
1个月前
已完结
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