Lv12
18 积分 2026-02-04 加入
3D Integrated Process and Hybrid Bonding of High Bandwidth Memory (HBM)
4小时前
待确认
Advanced Cu/Polymer Hybrid Bonding System for Fine‐Pitch 3D Stacking Devices
5小时前
已完结
Research progress of hybrid bonding technology for three-dimensional integration
6小时前
已完结
Cu/SnAg Pillar Bump Joints on Ni-Less Surface Finish in Laser Assisted Bonding (LAB)
6小时前
已完结
Heterogeneous Integration at Fine Pitch (≤ 10 µm) Using Thermal Compression Bonding
6小时前
已完结
Inhibiting the formation of interfacial voids in Cu/In/Cu microbump via Zn doping into Cu substrate
6小时前
已完结
A Cu/Ni/Cu/Sn1.8Ag microbump structure for void-free interface under long time high-temperature storage
7小时前
已完结
Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper
1天前
已完结
Modeling Digital Image Segmentation with Canny Method
8个月前
已关闭
Sliding window based adaptative fuzzy measure for edge detection
8个月前
已完结
Cervicogenic Headache: Diagnostic Criteria
4小时前
已采纳
Cerium and samarium codoped lithium aluminoborate glasses for white light emitting devices
5小时前
待审核
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