Lv11
50 积分 2025-03-21 加入
Low temperature solid-state diffusion bonding of fine pitch Cu/Sn micro-bumps assisted with formic acid vapor for 3D integration
3小时前
求助中
Advances and challenges in Copper–Copper bonding for 3D packaging interconnects
14天前
已完结
Electrochemical reduction of CO2 on pure and doped Cu2O(1 1 1)
2个月前
已完结
In situ FT-IR reveals ageing phenomena in the formation of a Cu/Zn/Zr methanol catalyst precursor
2个月前
已关闭
Adsorption behavior of heptyl xanthate on surface of ZnO and Cu(II) activated ZnO using continuous online in situ ATR-FTIR technology
2个月前
已完结
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere
4个月前
已完结
Influence of Hubbard U Parameter in Simulating Adsorption and Reactivity on CuO: Combined Theoretical and Experimental Study
4个月前
已完结
An iras study of formic acid and surface formate adsorbed on Cu(110)
5个月前
已完结
An iras study of formic acid and surface formate adsorbed on Cu(110)
5个月前
已完结
Infrared study of the adsorption of formic acid on silica-supported copper and oxidised copper catalysts
5个月前
已完结
皖公网安备34019202002308
