Lv1
80 积分 2025-03-21 加入
DFT and DFT-D3 Calculations of HCOOH Adsorption and Decomposition on Perfect and Defective Au(110) Surfaces
6天前
已完结
Relationship between the Reduction Behavior of Copper and Tin Oxide Films by Formic acid and Solder Wettability
6天前
已完结
Relationship between the Reduction Behavior of Copper and Tin Oxide Films by Formic acid and Solder Wettability
12天前
已完结
Relationship between the Reduction Behavior of Copper and Tin Oxide Films by Formic acid and Solder Wettability
12天前
已关闭
Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor
12天前
已完结
Tin oxide surfaces. Part 16.—Infrared study of the adsorption of formic acid, acrylic acid and acrolein on tin(IV) oxide, tin(IV) oxide–silica and tin(IV) oxide–palladium oxide
12天前
已完结
Low temperature solid-state diffusion bonding of fine pitch Cu/Sn micro-bumps assisted with formic acid vapor for 3D integration
27天前
已关闭
Low temperature solid-state diffusion bonding of fine pitch Cu/Sn micro-bumps assisted with formic acid vapor for 3D integration
1个月前
已关闭
Advances and challenges in Copper–Copper bonding for 3D packaging interconnects
1个月前
已完结
Electrochemical reduction of CO2 on pure and doped Cu2O(1 1 1)
3个月前
已完结
皖公网安备34019202002308
