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116 积分 2025-09-17 加入
The microparticles adhesion and removal dynamics in wafer-scale physical cleaning process
4天前
已完结
Realizing Ultrauniform Films at Wafer Scale through the Magnetron Sputtering Method
17天前
已完结
Effects of argon plasma pretreatment of Si wafers on Si-Si bonding based on Mo/Au interlayers
1个月前
已完结
A review of silicon-based wafer bonding processes, an approach to realize the monolithic integration of Si-CMOS and III–V-on-Si wafers
1个月前
已完结
Mechanism of Adhesion Particle Removal Using Supercritical CO2 and Simulation of Deep Groove Cleaning in Semiconductor
1个月前
已完结
Supercritical carbon dioxide fluid cleaning of extracellular polymeric substance surrogates on seawater reverse osmosis membranes
1个月前
已完结
Dangling Bond Defects on Si Surfaces and Their Consequences on Energy Band Diagrams: From a Photoelectrochemical Perspective
1个月前
已完结
Fluorine-free foaming extinguishing agent: Design route, fire extinguishing performance, foam stability mechanism
2个月前
已完结
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