Lv4
560 积分 2021-12-03 加入
Towards understanding the crack suppression mechanism in brittle materials with high grinding speed at different temperatures
5小时前
待确认
Study of CF4, C2F6, SF6 and NF3 Decomposition Characteristics and Etching Performance in Plasma State
5个月前
已完结
Atomic-Scale Etching Mechanism of Aluminum with Fluorine-Based Plasma
5个月前
已完结
Materials-Technology Co-Optimization (MTCO) for Inter-Die-Gap-Fill (IDGF) in Heterogeneous Integration of Chiplets
5个月前
已关闭
Materials-Technology Co-Optimization (MTCO) for Inter-Die-Gap-Fill (IDGF) in Heterogeneous Integration of Chiplets
5个月前
已关闭
A study on D2W Hybrid Cu bonding Technology for HBM Multi-die Stacking
6个月前
已完结
Thermal management materials for 3D-stacked integrated circuits
6个月前
已完结
Integrating silicon photonics with complementary metal–oxide–semiconductor technologies
6个月前
已完结
Recent Advances and Trends in Cu–Cu Hybrid Bonding
8个月前
已完结
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