Lv21
200 积分 2024-03-22 加入
Decoding the suppressing effects of Pluronic triblock copolymers on copper electrodeposition
1小时前
求助中
An overview of through-silicon-via technology and manufacturing challenges
1小时前
已完结
Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole
1小时前
已完结
An In Situ Polymerized Solid‐State Electrolyte for Uniform Lithium Deposition via the Piezoelectric Effects
3个月前
已完结
Unveiling the potential and mechanisms of 3,3′-bicarbazole-based quaternary ammonium salts as levelers
5个月前
已完结
Synthesis of coumarin derivatives as levelers for Through-Hole electroplating of copper in PCBs and a study on leveling mechanism of optimized leveler
5个月前
已完结
皖公网安备34019202002308
