Lv3
210 积分 2024-03-22 加入
Decoding the suppressing effects of Pluronic triblock copolymers on copper electrodeposition
3个月前
已关闭
An overview of through-silicon-via technology and manufacturing challenges
3个月前
已完结
Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole
3个月前
已完结
An In Situ Polymerized Solid‐State Electrolyte for Uniform Lithium Deposition via the Piezoelectric Effects
6个月前
已完结
Unveiling the potential and mechanisms of 3,3′-bicarbazole-based quaternary ammonium salts as levelers
9个月前
已完结
Synthesis of coumarin derivatives as levelers for Through-Hole electroplating of copper in PCBs and a study on leveling mechanism of optimized leveler
9个月前
已完结
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