Lv31
240 积分 2024-04-15 加入
Through glass via technology for advanced packaging: fabrication, metallization, applications, and reliability challenges
10小时前
待确认
Cornerstone of Next-Generation 3D Integration: Structures, Processes, and Applications of TGV
11天前
已完结
Research on a Glass Core Substrate Based on TGV Technology
19天前
已完结
Adhesion-promoting surface modification with zinc-oxide and graphene-oxide for direct electroless metallization in through-glass vias (TGVs)
23天前
已完结
Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review
23天前
已完结
Spin-coating synthesis of ZnO thin films for hydrogen gas sensing applications
25天前
已完结
High transparent and conductive ZnO/Ag/ZnO film structure
25天前
已完结
Using Azo As a Conductive and Adhesive Liner for through Glass Vias Filling By Cu Electroplating
1个月前
已关闭
Advances in green carbon quantum dots: heteroatom doping strategies for pesticide detection
4个月前
已完结
Bifunctional aerogel sensor array based on ratiometric fluorescent metal-organic frameworks for efficient adsorption and ultra-trace detection of organophosphorus pesticides
4个月前
已完结
皖公网安备34019202002308
