Lv1
18 积分 2025-09-13 加入
High thermal conductivity, low dielectric constant and good processability of epoxy composites achieved by boron nitride/hollow glass microsphere heterostructured particles
5天前
已完结
Synergistic enhancement of thermal conductivity in self-adhesive alumina-based thermal interface materials via hexagonal boron nitride size engineering
13天前
已完结
Synergistic enhancement of thermal conductivity in self-adhesive alumina-based thermal interface materials via hexagonal boron nitride size engineering
13天前
已完结
High-energy density dielectric film capacitors enabled by grain boundary engineering
3个月前
已完结
Thermally conductive and electrically insulative alumina/epoxy composites for advanced electronic packaging applications: A comprehensive review of filler morphologies and surface modifications
4个月前
已完结
Synergistically modulating multiscale polarizations in Al@Al2O3@TiO2/PVDF composites towards elevated integrating dielectric properties
4个月前
已完结
Synchronously improved thermal conductivity and dielectric constant for epoxy composites by introducing functionalized silicon carbide nanoparticles and boron nitride microspheres
4个月前
已完结
Synchronously improved thermal conductivity and dielectric constant for epoxy composites by introducing functionalized silicon carbide nanoparticles and boron nitride microspheres
4个月前
已完结
Vertically oriented boron nitride/silicon carbide scaffold for thermal-conductive and electrical-insulating phase change composites
4个月前
已完结
Vertically oriented boron nitride/silicon carbide scaffold for thermal-conductive and electrical-insulating phase change composites
4个月前
已完结
皖公网安备34019202002308
