Lv2
110 积分 2026-04-21 加入
Non-CMP Cu/SiO 2 Hybrid Bonding Based on Interlocking Structure
1天前
待确认
Low temperature wafer bonding by spin on glass
3个月前
已完结
Mechanics of plasma exposed spin-on-glass (SOG) and polydimethyl siloxane (PDMS) surfaces and their impact on bond strength
4个月前
已完结
Area-Selective Atomic Layer Deposition on Metal/Dielectric Patterns: Amphiphobic Coating, Vaporizable Inhibitors, and Regenerative Processing
5个月前
已完结
皖公网安备34019202002308
