Lv21
140 积分 2026-01-22 加入
Substrate Engineering for High‐Performance Ultrathin Copper Foils: Unveiling the Electronic‐Geometric Synergy of Low‐Range‐Order Ni‐W Alloys
9小时前
已完结
Unveiling the synergistic mechanism of binary additives for tailoring microstructure and enhancing the properties of high-performance electrodeposited copper foils
9小时前
已完结
Unlocking Superior Mechanical Performance in Electrolytic Copper Foils Through Synergistic Competitive Additives
9小时前
已完结
Effect of pulse electrodeposition process on the microstructure and properties of electrolytic copper foil as anode current collectors
2个月前
已完结
Planar Li deposition and dissolution enable practical anode-free pouch cells
3个月前
已完结
Grain‐Optimized Copper Current Collectors for Highly Stable Anode‐Free Sodium Batteries
3个月前
已完结
Effect of pulse electrodeposition process on the microstructure and properties of electrolytic copper foil as anode current collectors
3个月前
已完结
Ni-alloying induced microstructural evolution and enhanced heat-corrosion resistance of ultra-high-strength copper foils
4个月前
已完结
Study on Microstructure, Corrosion, and Heat Resistance of Ni/Cu/Ni Composite Foil and Battery Application
4个月前
已完结
Achieving high-strength and high-ductility electrolytic copper foils through grain structure control
5个月前
已完结
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