Lv32
270 积分 2025-06-13 加入
Thermal management materials for 3D-stacked integrated circuits
1小时前
已完结
A Review on Commercial Oligonucleotide Drug Products
1个月前
已完结
A 26/28/39-GHz Reconfigurable Phased-Array Receiver Front-End With Built-In Calibration Technique for 5G New Radio
1个月前
已关闭
Wideband Circularly Polarized Active Heatsink Antenna Array
1个月前
已关闭
Polymer Composite with Improved Thermal Conductivity by Constructing a Hierarchically Ordered Three-Dimensional Interconnected Network of BN
2个月前
已完结
Thermal management materials for 3D-stacked integrated circuits
2个月前
已完结
Multifunctional, Hybrid Materials Design via Spray‐Drying: Much more than Just Drying
4个月前
已完结
Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging
6个月前
已完结
Challenges and prospects for advanced packaging
6个月前
已关闭
Recent progress on cubic boron arsenide with ultrahigh thermal conductivity
6个月前
已完结