Lv5
820 积分 2025-06-13 加入
Constructing a “pea-pod-like” alumina-graphene binary architecture for enhancing thermal conductivity of epoxy composite
2个月前
已完结
Enhanced thermal conductivity of epoxy/alumina composite through multiscale-disperse packing
2个月前
已完结
Thermal management materials for 3D-stacked integrated circuits
4个月前
已完结
A Review on Commercial Oligonucleotide Drug Products
5个月前
已完结
A 26/28/39-GHz Reconfigurable Phased-Array Receiver Front-End With Built-In Calibration Technique for 5G New Radio
5个月前
已关闭
Wideband Circularly Polarized Active Heatsink Antenna Array
5个月前
已关闭
Polymer Composite with Improved Thermal Conductivity by Constructing a Hierarchically Ordered Three-Dimensional Interconnected Network of BN
6个月前
已完结
Thermal management materials for 3D-stacked integrated circuits
6个月前
已完结
Multifunctional, Hybrid Materials Design via Spray‐Drying: Much more than Just Drying
8个月前
已完结
Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging
10个月前
已完结
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