Lv52
970 积分 2024-11-29 加入
Towards understanding the coupling interaction between thickness non-uniformity and flatness of wafer-scale electroformed Ni-Co mold: from grain structures to internal stress
1个月前
已关闭
Optimal design of splicing structure for metal working molds of cube corner retroreflective sheeting
1个月前
已完结
Micro Pattern Roll Mold for Large Area Display by Electroforming and Wrapping Method
9个月前
已完结
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