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516 积分 2023-03-25 加入
Mechanically Enhanced, Environmentally Stable, and Bioinspired Charge‐Gradient Hydrogel Membranes for Efficient Ion Gradient Power Generation and Linear Self‐Powered Sensing
1个月前
已完结
Multi-objective optimization of injection molding process parameters for short cycle time and warpage reduction using conformal cooling channel
1个月前
已完结
Multimodal Finger‐Shaped Tactile Sensor for Multi‐Directional Force and Material Identification
1个月前
已完结
Influence of IMC morphology on fatigue stress, strain and life of solder layer between SiC chip and DBC substrate in IGBT under thermal cycling
1个月前
已完结
Reduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compound
1个月前
已完结
Modeling the cure shrinkage–induced warpage of epoxy molding compound
1个月前
已完结
Enhanced microstructure and mechanical property of large-area nano-Ag joints by porous Cu foam at low temperature
1个月前
已完结
Mechanical properties and microstructure of large-area diamond/silicon bonds formed by pressure-assisted silver sintering for thermal management
1个月前
已完结
Simultaneous solar-driven interfacial evaporation and phenol degradation using three-dimensional MoS2-melamine foam
1个月前
已完结
Wireless Passive Flexible Radio Frequency Tactile Sensor for Material Recognition
1个月前
已完结
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