Lv412
710 积分 2023-03-25 加入
Characterization of packaging warpage, residual stress and their effects on the mechanical reliability of IGBT power modules
3天前
已完结
Warpage and Reliability Challenges for Stacked Silicon Interconnect Technology in Large Packages
3天前
已完结
Characterization of packaging warpage, residual stress and their effects on the mechanical reliability of IGBT power modules
4天前
已完结
A review on warpage measurement metrologies for advanced electronic packaging
4天前
已完结
Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition
4天前
已完结
An inverse analysis of warpage for trilayer thin-plate under thermal cycles
5天前
已完结
State-of-the-art of Power Cycling Lifetime Models for Power Electronics
16天前
已完结
Reduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compound
18天前
已完结
Epoxy molding compounds for high-performance electronic packaging: A review on recent studies
18天前
已完结
New compact, high performance 7th Generation IGBT module with direct liquid cooling for EV/HEV inverters
1个月前
已完结
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