Lv41
504 积分 2023-03-25 加入
Computational Analysis of Thermal Performance of Heat Sinks with Foam Structures
6天前
已完结
Integrated Water Flow Channels Within the PCB Substrate for Power Electronics Cooling
6天前
已完结
Comparison between the Theoretical, Experimental and Numerical Thermal Conductivity of Composite Thermal Interface Materials using Copper Metal Foam
6天前
已完结
Thermal Management of Microelectronic Devices Using Nanofluid with Metal foam Heat Sink
6天前
已完结
A novel double-sided cooling packaging structure of SiC-based half bridge module integrating the laminated busbar
8天前
已完结
Warping model of high-power IGBT modules subjected to reflow soldering process
10天前
已完结
High-Pressure-Assisted Large-Area (>2400 mm2) Sintered-Silver Substrate Bonding for SiC Power Module Packaging
10天前
已完结
Junction Temperature Measurement Based on Electroluminescence Effect in Body Diode of SiC Power MOSFET
14天前
已完结
A hybrid slot jet impingement/microchannel heat sink for cooling high-power electronic devices: A combined experimental and numerical study
16天前
已关闭
Warpage modeling for semiconductor power module manufacturing flow improvement
18天前
已完结
皖公网安备34019202002308
