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wangli
Lv3
210 积分
2023-03-25 加入
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Novel bonding and joining technology for power electronics - Enabler for improved lifetime, reliability, cost and power density
14天前
已关闭
Railway traction DC–DC converter: Comparison of Si, SiC-hybrid, and full SiC versions with 1700 V power modules
1个月前
已完结
A 5-kV pulse generator with a 100-kV/µs slew rate based on series-connected 1700-V SiC MOSFETs for electrical insulation tests
1个月前
已完结
Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages
4个月前
已完结
Analysis model for thermal resistance of double-sided cooling power module with pin–fin heat sink used in xEVs
4个月前
已完结
Thermal cycling of strained nickel‐coated glass‐epoxy composite laminates: Effects on macro mechanical and fiber‐matrix interface properties
4个月前
已完结
Self-adaptive cooling of chips with unevenly distributed high heat fluxes
4个月前
已完结
A Critical Review and Perspective on Thermal Management of Power Electronics Modules for Inverters and Converters
4个月前
已完结
A Predictive Model for Thermal Conductivity of Nano-Ag Sintered Interconnect for a SiC Die
4个月前
已完结
Thermomigration-induced failure in ball grid array solder joint under high current stressing
5个月前
已完结
没有进行任何应助
找到了【积分已退回】
14天前
我已经解决了,谢谢
1年前
下的不是自己需要的
1年前
找的不相关,谢谢
1年前
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