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446 积分 2023-03-25 加入
Design and intelligent optimization of TSV-based embedded microchannel heatsinks in 2.5D Packaging
7小时前
已完结
Novel and Ruggedized Power Electronics for Off-Highway Vehicles
1天前
已完结
Silicon Carbide Inverter for Off-Road Heavy-Duty Applications: The importance of thermal and thermomechanical design in power electronics packaging
1天前
已完结
Efficiency Evaluation of an Automotive 800V HV/LV DCDC Converter Comparing IGBTs and SiC MOSFETs Semiconductors
1天前
已完结
800V, 500k W High Power Density SiC Traction Inverter for Electric Vehicles
1天前
已完结
Current and future directions in power electronic devices and circuits based on wide band-gap semiconductors
1天前
已完结
An 800V End to End SiC Powertrain to Accommodate Extremely Fast Charging
1天前
已完结
PEEC Method and Hierarchical Approach Towards 3D Multichip Power Module (MCPM) Layout Optimization
7天前
已完结
Gate Circuit Layout Optimization of Power Module Regarding Transient Current Imbalance
7天前
已完结
Parasitic Extraction Procedures for SiC Power Modules
7天前
已完结
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