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36 积分 2026-03-29 加入
A review of development and applications of SiC power devices in packaging and interconnect technology
1个月前
已完结
Interfacial reaction and phase evolution in Ag and In solders for advanced low-temperature bonding technology
3个月前
已完结
The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach
3个月前
已完结
Experimental investigation of thermal conductivity during aging of nanoporous sintered silver
3个月前
已完结
Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods
3个月前
已完结
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
3个月前
已完结
Packaging of Integrated Optics Devices
3个月前
已关闭
Packaging technologies of integrated photonics
3个月前
已关闭
Electrochemical Migration in Multichip Modules
5个月前
已关闭
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