Lv320
280 积分 2026-07-13 加入
高温高压硅熔体渗透制备金刚石/碳化硅复合材料及其性能研究
14天前
已完结
Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers
22天前
已完结
Interfacial Reaction Boosts Thermal Conductance of Room‐Temperature Integrated Semiconductor Interfaces Stable up to 1100 °C
24天前
已完结
Direct Integration of Polycrystalline Diamond With 3C‐SiC for Enhanced Thermal Management in GaN HEMTs: Impact of Grain Structure and Interface Engineering
24天前
已完结
Analysis of Heat Diffusion in GaN/3C-SiC/Diamond HEMTs for Design Optimization
24天前
已完结
Theoretical insights into β-Ga2O3/diamond heterojunction interfaces: Surface selection, band alignment, and interfacial interaction
24天前
已完结
A comprehensive review of diamond/copper composites for high thermal conductivity applications
25天前
已完结
Depth and substrate dependence of heat dissipation in GaN p-n diodes bonded to AlN, diamond, and SiC
25天前
已完结
High-performance heat sinking for VLSI
25天前
已完结
Unified Parametric Optimization Framework for Microchannel Fin Geometries in High-Power Processor Cooling
25天前
已完结
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