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4200 积分 2022-05-21 加入
High Efficiency Polymer based Direct Multi-jet Impingement Cooling Solution for High Power Devices
5个月前
已完结
Co-designing electronics with microfluidics for more sustainable cooling
6个月前
已完结
Cooling Systems of Power Semiconductor Devices—A Review
6个月前
已完结
Package-Level Integration of Liquid Cooling Technology with Microchannel IHS for High Power Cooling
6个月前
已完结
Design, integration and performance analysis of a lid-integral microchannel cooling module for high-power chip
6个月前
已完结
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