Lv6
3100 积分 2022-05-21 加入
Low-Temperature Co-hydroxylated Cu/SiO2 Hybrid Bonding Strategy for a Memory-Centric Chip Architecture
5小时前
已完结
Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper–copper bonding
5小时前
已完结
High-performance ultra-thin thermal ground plane based on parallel liquid-vapor paths using hierarchical wicking structures
21天前
已关闭
A 0.25-mm-thick ultra-conductive thermal ground plane for cooling compact electronics
21天前
已完结
Effects of forming gas plasma treatment on low-temperature Cu–Cu direct bonding
24天前
已完结
Low temperature de-oxidation for copper surface by catalyzed formic acid vapor
24天前
已完结
Fabrication, characterization and application of gold nano-structured film
24天前
已完结
Tuning the Deoxygenation of Bulk-Dissolved Oxygen in Copper
24天前
已完结
The effect of forming gas anneal on the oxygen content in bonded copper layer
24天前
已完结
Cu–Cu direct bonding in air by in-situ reduction of copper oxide with glycerol
24天前
已完结
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