Lv2
118 积分 2022-02-23 加入
Thermal conductive and flexible silastic composite based on a hierarchical framework of aligned carbon fibers-carbon nanotubes
10天前
已完结
Color-Shifting Iontronic Skin for On-Site, Nonpixelated Pressure Mapping Visualization
20天前
已完结
An integrated multi-scale structured heat sink for the efficient heat dissipation of two-phase immersion-cooled chips
1个月前
已完结
Hinged ultrathin flexible heat pipe for high efficient heat dissipation of the foldable microelectronic devices
1个月前
已关闭
Design and characterization of novel graphene-enhanced vapor chambers for lightweight and high-performance electronics cooling
1个月前
已完结
High thermal conductivity copper/graphene composites for efficient thermal management
1个月前
已完结
A novel ultra-thin vapor chamber based on graphite copper-clad film for thermal management in electronic devices
1个月前
已完结
High-precision additive manufacturing enabled ultra-thin flexible vapor chamber for adaptive and efficient electronic cooling
1个月前
已完结
Highly efficient bio-inspired manifold microchannel cooling for steady-state and transient thermal management of high-power chips
1个月前
已完结
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