Lv2
118 积分 2022-02-23 加入
An integrated multi-scale structured heat sink for the efficient heat dissipation of two-phase immersion-cooled chips
10天前
已完结
Hinged ultrathin flexible heat pipe for high efficient heat dissipation of the foldable microelectronic devices
12天前
已关闭
Design and characterization of novel graphene-enhanced vapor chambers for lightweight and high-performance electronics cooling
15天前
已完结
High thermal conductivity copper/graphene composites for efficient thermal management
17天前
已完结
A novel ultra-thin vapor chamber based on graphite copper-clad film for thermal management in electronic devices
18天前
已完结
High-precision additive manufacturing enabled ultra-thin flexible vapor chamber for adaptive and efficient electronic cooling
18天前
已完结
Highly efficient bio-inspired manifold microchannel cooling for steady-state and transient thermal management of high-power chips
18天前
已完结
Enhanced strength–ductility synergy of SiC particles reinforced aluminum matrix composite via dual configuration design of reinforcement and matrix
3个月前
已完结
Effects of size and oxidation treatment for SiC particles on the microstructures and mechanical properties of SiCp/Al composites prepared by powder metallurgy
3个月前
已完结
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