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Bonding GaN on high thermal conductivity graphite composite with adequate interfacial thermal conductance for high power electronics applications
22小时前
已完结
Wafer-scale bonded GaN–AlN with high interface thermal conductance
22小时前
已完结
Demonstration of high thermal performance GaN-on-graphite composite bonded substrate for application in III-V nitride electronics
22小时前
已完结
High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes
1天前
已完结
Three-sensor 3ω-2ω method for the simultaneous measurement of thermal conductivity and thermal boundary resistance in film-on-substrate heterostructures
15天前
已完结
Interdependent optimization strategies for material, module, and system designs in thermoelectric devices
22天前
已完结
Fabrication of low thermal resistance 3C-SiC/diamond structure for GaN epitaxial layer growth
1个月前
已完结
High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes
1个月前
已完结
Low Thermal Boundary Resistance Interfaces for GaN-on-Diamond Devices
1个月前
已完结
Suspended-ultrathin Si membrane on SOI: a novel structure to reduce thermal stress of GaN epilayer
2个月前
已完结
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