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20 积分 2025-02-28 加入
Diamond coatings on copper surfaces through interface engineering
3个月前
已完结
Ultralow-k Amorphous Boron Nitride Film for Copper Interconnect Capping Layer
3个月前
已完结
AlN coatings with high thermal conductivity and excellent electrical properties for thermal management devices
3个月前
已完结
Glycine-modified BN/epoxy resin composites with directional arranged fillers for thermal management
4个月前
已完结
Development and mapping thermally-conductive, electrically-insulating composite coatings for thermal management of electronics
4个月前
已完结
Evaluation of Materials for Fan-Out Panel Level Packaging (FOPLP) Applications
4个月前
已完结
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