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106 积分 2025-02-13 加入
Development of Die-Bonding Film for Semiconductor Packages Applied Reaction-Induced Phase Separation
6天前
已完结
Melamine–graphene epoxy nanocomposite based die attach films for advanced 3D semiconductor packaging applications
26天前
已完结
Melamine–graphene epoxy nanocomposite based die attach films for advanced 3D semiconductor packaging applications
1个月前
已完结
Multi‐objective Optimization in Complex Biomass Conversion Processes
1个月前
已完结
AI‐Assisted Design of Advanced Polymeric Materials: Challenges and Solutions
4个月前
已完结
Machine learning boosting the discovery of porous metamaterials with an abnormal thermal transport property
4个月前
已完结
Strategies for optimizing interfacial thermal resistance of thermally conductive hexagonal boron nitride/polymer composites: A review
4个月前
已完结
An Improved Thermal Coupling Network Model Considering Thermal Interface Material Aging of IGBT Modules
7个月前
已完结
2D Materials‐Based Thermal Interface Materials: Structure, Properties, and Applications
7个月前
已完结
Enhanced thermal conductivity of epoxy resin by incorporating three-dimensional boron nitride thermally conductive network
7个月前
已完结
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