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Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model. Journal of Electronic Packaging
23小时前
待确认
Reduced-Order Modeling for Efficient Reliability Assessment of Package–Board Interactions
4个月前
已完结
Integrated Fan‐Out (InFO) for High Performance Computing Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System‐in‐Package
6个月前
已关闭
High-frequency characterization of through package vias formed by focused electrical-discharge in thin glass interposers. Proceedings - Electronic Components and Technology Conference
6个月前
已完结
Electromigration in three-dimensional integrated circuits
6个月前
已完结
Advancements in mechanical characterization techniques and environmental effects on bi-material interfaces in microelectronics: a literature review
6个月前
已完结
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