Lv12
60 积分 2025-09-16 加入
Thermal and Electrical Study of Glass Interposers in Co-Packaged Electronic–Photonic Systems
13小时前
已完结
Selective Epoxy Mold Compound Slurry for Advanced Packaging Technology
2个月前
已完结
A noble VFO(Vertical wire Fan Out) technology for small form factor and high performance memory applications
5个月前
已完结
Nanograin‐Twin‐Nanograin Alternating Composite Structure Enable Improved Cross‐Interface Cu─Cu Bonding at Low Thermal Budgets
6个月前
已完结
A State‐of‐the‐Art Review of Through‐Silicon Vias : Filling Materials, Filling Processes, Performance, and Integration
6个月前
已完结
Single-crystalline LiNbO3 integrated onto Si-based substrates via Ar plasma-activated low-temperature direct bonding
6个月前
已完结
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