Lv11
50 积分 2025-09-16 加入
Nanograin‐Twin‐Nanograin Alternating Composite Structure Enable Improved Cross‐Interface Cu─Cu Bonding at Low Thermal Budgets
1小时前
已完结
A State‐of‐the‐Art Review of Through‐Silicon Vias : Filling Materials, Filling Processes, Performance, and Integration
7天前
已完结
Single-crystalline LiNbO3 integrated onto Si-based substrates via Ar plasma-activated low-temperature direct bonding
8天前
已完结
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