Lv4
530 积分 2025-09-16 加入
Integration of Lasers with Silicon Photonics by Flip Chip and Heteroepitaxy
13小时前
待确认
TSMC in the Silicon Photonics Era - an electrical perspective
13小时前
求助中
Hybrid Integration of Thin-film Lithium Niobate and Silicon Photonics
14小时前
待确认
EPIC-BOE: An Electronic-Photonic Chiplet Integration Technology with IC Processes for Broadband Optical Engine Applications
15小时前
已完结
Silicon Photonics Platform for Next Generation Data Communication Technologies
16小时前
已完结
Thermal and Electrical Study of Glass Interposers in Co-Packaged Electronic–Photonic Systems
6天前
已完结
Selective Epoxy Mold Compound Slurry for Advanced Packaging Technology
2个月前
已完结
A noble VFO(Vertical wire Fan Out) technology for small form factor and high performance memory applications
5个月前
已完结
Nanograin‐Twin‐Nanograin Alternating Composite Structure Enable Improved Cross‐Interface Cu─Cu Bonding at Low Thermal Budgets
6个月前
已完结
A State‐of‐the‐Art Review of Through‐Silicon Vias : Filling Materials, Filling Processes, Performance, and Integration
7个月前
已完结
皖公网安备34019202002308
