Lv4
710 积分 2026-04-29 加入
Investigation of surface reactions of etched SiN films using HF/PF3 gas mixture plasma under cryogenic conditions via in-line XPS: The role of ammonium salts in etch rate enhancement
1个月前
已完结
Pseudo-Wet Plasma Mechanism Enabling High-Throughput Dry Etching of SiO2 by Cryogenic-Assisted Surface Reactions
2个月前
已完结
Selectivity between SiO2 and SiNx during Thermal Atomic Layer Etching Using Al(CH3)3/HF and Spontaneous Etching Using HF and Effect of HF + NH3 Codosing
2个月前
已完结
NAND Flash Innovations and Future Scaling
2个月前
已完结
Dry etching in the presence of physisorption of neutrals at lower temperatures
2个月前
已完结
Low-temperature etching of silicon oxide and silicon nitride with hydrogen fluoride
2个月前
已完结
Effect of gas additives on reaction barriers in cryo etching of silicon oxide and nitride
2个月前
已完结
Use of an auxiliary electrode to control plasma properties at the wafer edge in inductively coupled plasmas with a substrate bias
2个月前
已关闭
Use of an auxiliary electrode to control plasma properties at the wafer edge in inductively coupled plasmas with a substrate bias
2个月前
已关闭
Beyond 10 μm Depth Ultra-High Speed Etch Process with 84% Lower Carbon Footprint for Memory Channel Hole of 3D NAND Flash over 400 Layers
3个月前
已完结