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88 积分 2026-01-17 加入
Ti/Pt/AuSn metallization scheme for bonding of InP-based laser diodes to chemical vapor deposited diamond submounts
1个月前
已完结
An Overview of Phase Diagram and Thermodynamic Parameters of Pt–Au–Sn System
1个月前
已完结
A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging
2个月前
已完结
Research on the Influence Mechanism of Thermal Load on the Au-Sn Sealing Weld State on Three-Dimensional DPC Substrates
2个月前
已完结
High Power Conduction Cooled Annular Diode Laser Stack Packaged by Gold-Tin Hard Solder
2个月前
已完结
Development of advanced AuSn alloy plating technology for semiconductor application
3个月前
已完结
Ti/Pt/AuSn metallization scheme for bonding of InP-based laser diodes to chemical vapor deposited diamond submounts
4个月前
已关闭
Study on the preparation of Au-Sn eutectic alloy solder for electronic packaging and gold purification
4个月前
已完结
in Design and Implementation of Metallization Structures for Epi-down Bonded High Power Semiconductor Lasers
4个月前
已完结
Enthalpy of formation of intermetallic phases from the Au–Sn system
4个月前
已完结
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