Lv21
110 积分 2026-01-17 加入
Development of advanced AuSn alloy plating technology for semiconductor application
2小时前
待确认
Ti/Pt/AuSn metallization scheme for bonding of InP-based laser diodes to chemical vapor deposited diamond submounts
21天前
已关闭
Study on the preparation of Au-Sn eutectic alloy solder for electronic packaging and gold purification
26天前
已完结
in Design and Implementation of Metallization Structures for Epi-down Bonded High Power Semiconductor Lasers
1个月前
已完结
Enthalpy of formation of intermetallic phases from the Au–Sn system
1个月前
已完结
Review of thin film deposition and techniques
1个月前
已完结
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