| 标题 |
Ti/Pt/AuSn metallization scheme for bonding of InP-based laser diodes to chemical vapor deposited diamond submounts |
| 网址 | |
| DOI |
10.1016/0254-0584(93)90076-X
doi
|
| 求助人 | |
| 下载 |
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(2025-6-4)