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790 积分 2026-09-16 加入
Multiscale XFEM–CZM simulation of crack propagation in silica/epoxy nanocomposites with interfacial contact effects
7小时前
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Impact of curing profiles on the Thermo-Mechanical properties of an underfill in Board-Level microelectronic Packaging: Effect on reliability
7小时前
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Pre-structural patterning approach for enhancing flow characteristics of B-stage film-type epoxy molding compound
7小时前
待确认
Low thermal expansion and high thermal conductivity in epoxy molding compounds achieved via a dual-strategy of negative thermal expansion Cu2V2O7 and conductive fillers
7小时前
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Synergistic effect of nanotextured graphene oxide modified with hollow silica microparticles on mechanical and thermal properties of epoxy nanocomposites
7小时前
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Tri-functionally modified spherical silica for high-performance epoxy resin sealant
7小时前
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Quantitative evaluation of crack arrest mechanisms in epoxy/silica nanocomposites
7小时前
待确认
Enhancing thermal mechanical properties of polymer composites with hollow porous fillers
7小时前
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Epoxy composite films of superior dielectric properties promoted by active ester hardeners for applications in electronic packaging
8小时前
待确认
Biphenylation, ester-free and stepwise reaction strategy of thiol-epoxy crosslinking network for durable thermally and hygrothermally resistant electronic packaging
8小时前
待确认
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