Lv11
44 积分 2026-06-30 加入
Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers
1小时前
待确认
Room temperature bonding of diamond/Si with Mo/Au interlayers in atmospheric air
1小时前
已完结
A review in thermal management for advanced chip packaging from chip to heat sink
6天前
已完结
Processing and thermal characterization of polymer derived SiCN(O) and SiOC reticulated foams
14天前
已完结
Development of High Thermal Conductance Wafer Bonding Interface with PVD Aluminum Nitride
14天前
已完结
Novel Bonding Interfacial Material for Carrier Wafer of BSPDN & Reconstructed D2W Integration
14天前
已完结
Thermal solution study of 51.2T Near-packaged optics switch
1个月前
已完结
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
1个月前
已完结
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