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70 积分 2024-11-11 加入
Thermal management materials for 3D-stacked integrated circuits
3天前
已完结
The heterogeneous integration of electronic components
3天前
已完结
First principle calculations of electronic and optical properties of NiSi2
4个月前
已完结
Silicon carbide for integrated photonics
6个月前
已完结
Low loss 4H-SiC photonics for spin-quantum sensing
6个月前
已完结
Upscaling high-areal-capacity battery electrodes
9个月前
已完结
In Situ Converting Conformal Sacrificial Layer Into Robust Interphase Stabilizes Fluorinated Polyanionic Cathodes for Aqueous Sodium‐Ion Storage
9个月前
已关闭
Wet etch clean-up of plasma damage for 1.68 kV breakdown in NiO/β-Ga2O3 chlorine-etched PN diodes
10个月前
已关闭
Lattice defects distribution of H+ implanted 4H-SiC investigated by deep-ultraviolet Raman spectroscopy
10个月前
已完结
Is SiC a Predominant Technology for Future High Power Electronics?: A Critical Review
11个月前
已完结
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