Lv6505
3100 积分 2024-11-10 加入
A new electrochemical approach for the synthesis of copper-graphene nanocomposite foils with high hardness
6天前
已完结
Electrodeposited copper using direct and pulse currents from electrolytes containing low concentration of additives
6天前
已完结
Biosynthesis of highly pure poly-γ-glutamic acid for biomedical applications
6天前
已完结
An investigation of the influence of temperature on the adsorption of the chiral modifier, (S)-glutamic acid, on Ni{111}
6天前
已完结
In situ hydrazine reduced silver colloid synthesis – Enhancing SERS reproducibility
13天前
已完结
Alkyl-terminated PEG suppressors for copper electroplating and their hydrophilic and hydrophobic properties
19天前
已完结
3-((2-ethoxyethanethioyl)thio)propane-1-sodium sulfonate as a new accelerator for copper electroplating: Electrochemical and theoretical calculation studies
19天前
已完结
Function of Sulfhydryl (–HS) Group During Microvia Filling by Copper Plating
19天前
已完结
Effects of Additives in an Electrodeposition Bath on the Surface Morphologic Evolution of Electrodeposited Copper
19天前
已完结
Effects of 2-mercaptopyridine and Janus Green B as levelers on electrical resistance of electrodeposited copper thin film for interconnects
1个月前
已完结
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