Lv6459
2740 积分 2024-11-10 加入
Effects of 2-mercaptopyridine and Janus Green B as levelers on electrical resistance of electrodeposited copper thin film for interconnects
10天前
已完结
The Adsorption Structure of Polyethylene Imine on Copper Surfaces for Electrodeposition
10天前
已完结
Modeling the Charge-Transfer Resistance to Determine the Role of Guar and Activated Polyacrylamide in Copper Electrodeposition
10天前
已完结
Synergistic effects of gelatin and convection on copper foil electrodeposition
10天前
已完结
Electrodeposition, microstructure and characterization of high-strength, low-roughness copper foils with polyethylene glycol additives
11天前
已完结
Trace bis-(3-sulfopropyl)-disulfide enhanced electrodeposited copper foils
11天前
已完结
Grain control and property regulation of electrolytic copper foils with ethylene thiourea additive
11天前
已完结
Manipulating the adhesion of electroless plated Cu film on liquid polymer crystal substrate for advanced microelectronic manufacturing
19天前
已完结
A high-performance hydrogenation catalyst: Synergistic effects of Pd nanoparticles and iron-functionalized tetrameric polyoxometalate platform
28天前
已完结
Pt Nanoparticles Supported over Porous Porphyrin Nanospheres for Chemoselective Hydrogenation Reactions
29天前
已完结
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