Lv6
3122 积分 2024-01-10 加入
Coupling, tailoring, and applications of 2D magnetic materials
1天前
已完结
Carbon science perspective in 2026: Current research and future challenges
4天前
已完结
Improving dispersibility of lanthanide-doped upconversion nanoparticles for luminescence applications in medium polarity solvents
6天前
已完结
Through-Silicon Vias and 3D Inductors for RF Applications
23天前
已关闭
Bottom-up filling of through-silicon vias due to suppressor desorption
23天前
已关闭
Experimental study on sheet resistivity and thickness measurement in Copper Electroplating
23天前
已关闭
3D THROUGH-SILICON VIA FILLING WITH ELECTROCHEMICAL NANOMATERIALS
23天前
已关闭
Triblock Copolymers as Suppressors for Microvia Filling via Copper Electroplating
23天前
已完结
皖公网安备34019202002308
