Lv2
180 积分 2024-04-10 加入
Influence of Au Substrate Crystal Structure on Ag-Au Inter-diffusion for WBG Packaging
1个月前
已完结
Grain boundary characterisation in superplastic deformation of Al-Li alloy using electron backscatter diffraction
5个月前
已完结
Progressive steps in the development of electron backscatter diffraction and orientation imaging microscopy
5个月前
已完结
Grain boundary characterisation in superplastic deformation of Al-Li alloy using electron backscatter diffraction
5个月前
已完结
Grain boundary characterisation in superplastic deformation of Al-Li alloy using electron backscatter diffraction
5个月前
已完结
Rapid estimation of elastic constants by molecular dynamics simulation under constant stress
5个月前
已完结
Automated Heatsink Optimization for Air-Cooled Power Semiconductor Modules
7个月前
已完结
Compact Sandwiched Press-Pack SiC Power Module With Low Stray Inductance and Balanced Thermal Stress
7个月前
已完结
Development of SiC power module structure by micron-sized Ag-paste sinter joining on both die and heatsink to low-thermal-resistance and superior power cycling reliability
7个月前
已完结
EMI Mitigation for SiC Power Module with Chip-on-Ceramic Heatsink Packaging
7个月前
已完结
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