Lv2
192 积分 2024-04-10 加入
Grain boundary characterisation in superplastic deformation of Al-Li alloy using electron backscatter diffraction
3个月前
已完结
Progressive steps in the development of electron backscatter diffraction and orientation imaging microscopy
3个月前
已完结
Grain boundary characterisation in superplastic deformation of Al-Li alloy using electron backscatter diffraction
3个月前
已完结
Grain boundary characterisation in superplastic deformation of Al-Li alloy using electron backscatter diffraction
3个月前
已完结
Rapid estimation of elastic constants by molecular dynamics simulation under constant stress
3个月前
已完结
Automated Heatsink Optimization for Air-Cooled Power Semiconductor Modules
5个月前
已完结
Compact Sandwiched Press-Pack SiC Power Module With Low Stray Inductance and Balanced Thermal Stress
5个月前
已完结
Development of SiC power module structure by micron-sized Ag-paste sinter joining on both die and heatsink to low-thermal-resistance and superior power cycling reliability
5个月前
已完结
EMI Mitigation for SiC Power Module with Chip-on-Ceramic Heatsink Packaging
5个月前
已完结
皖公网安备34019202002308
