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4077 积分 2024-05-27 加入
Structure of AlAl and AlSi3N4 interfaces bonded at room temperature by means of the surface activation method
2个月前
已关闭
Sequentially Plasma Activated Bonding for Wafer Scale Nano-Integration
2个月前
已完结
Application of Surface Activated Bonding Technology in Heterogeneous Integration of Wide Band-Gap Semiconductors
2个月前
已完结
Recent Progress in Surface Activated Bonding for 3D and Heterogeneous Integration
2个月前
已完结
Argon Ion Beam Current Dependence of Si-Si Surface Activated Bonding
2个月前
已完结
Prebonding Baking of Wafers for Improved Surface Activated Bonding
2个月前
已完结
A review of silicon-based wafer bonding processes, an approach to realize the monolithic integration of Si-CMOS and III–V-on-Si wafers
2个月前
已完结
Adsorption by Powders and Porous Solids
2个月前
已完结
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