Lv21
160 积分 2020-12-07 加入
Fabrication of UV-induced peelable adhesives using acrylic copolymers containing photo-initiators and soybean oil based urethane acrylate oligomers
9个月前
已完结
Sidewall Chipping Investigation & Challenges on 100um Thin Low-K Wafer with DAF
9个月前
已完结
The Challenges of Wafer Blade Dicing by Minimize Die Size
10个月前
已完结
Materials for Advanced Packaging
1年前
已完结
Assembly Process and Application Studies of Pre-Applied Underfill Non-Conductive Film (NCF) and Non-Conductive Paste (NCP) for Advanced Packages
1年前
已完结
Development of a Flexure Mechanism for Thin Die Pick-up Process
1年前
已完结
Benzethonium chloride as a tungsten corrosion inhibitor in neutral and alkaline media for the post-chemical mechanical planarization application
2年前
已完结
Selective Removal of Gold: N-Heterocyclic Carbenes as Positive Etch Resists on Planar Gold Surfaces
2年前
已完结
Inverse metal-assisted chemical etching of germanium with gold and hydrogen peroxide
2年前
已完结
Development of Tough Thermoplastic Elastomers by Leveraging Rigid–Flexible Supramolecular Segment Interplays
2年前
已完结
TMEM100 negatively regulated by microRNA‑106b facilitates cellular apoptosis by suppressing survivin expression in NSCLC
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