Lv51
890 积分 2023-12-20 加入
Ribbed package geometry for reducing thermal warpage and wire sweep during PBGA encapsulation
3天前
已完结
液体压缩模具底部填充物设计用于包覆成型工艺中的一步封装
1个月前
已完结
Artificial Intelligence-Based Warpage Prediction Model for Accelerating Thermo-Mechanical Simulation in Advanced Packaging
3个月前
已完结
液体环氧塑封料的应用进展
5个月前
已完结
New Double Sided Molded Package Platform Development with Open Cavity Mold on One Side and Exposed Die Mold on the Other Side
6个月前
已完结
TXV Technology: The Cornerstone of 3D System-in-Packaging
6个月前
已完结
Mechanical Reliability Analysis of Dual Side Molding SiP Module
6个月前
已完结
Alternative 3D Double Side Molded SiP for 5G Communication
6个月前
已完结
Double Side System in Package Development Challenge for Heterogeneous Integration
6个月前
已完结
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