Lv62
2590 积分 2023-12-20 加入
Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure
1个月前
已完结
Thermal-mechanical reliability enhancement of thermal interface material in lidded FCBGA packaging via SVR-based coverage degradation prediction
1个月前
已完结
Current Advances and Outlooks in Hybrid Bonding
4个月前
已完结
AReviewofSystem-in-Package Technologies: Application and Reliability of Advanced Packaging
5个月前
已完结
Challenges and recent prospectives of 3D heterogeneous integration
5个月前
已完结
Study of Fabrication and Reliability for the Extremely Large 2.5D Advanced Package
5个月前
已完结
Overview of Thermal Modeling and Monitoring for SiC Multi-Chip Power Modules
6个月前
已完结
A novel room-temperature surface Si3N4 patterned As+ ion implant solution to wafer warpagemodulation in 3D NAND flash fabrication
6个月前
已完结
Recent Advances and Trends in Advanced Packaging
7个月前
已完结
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