Lv6
1900 积分 2023-12-20 加入
AReviewofSystem-in-Package Technologies: Application and Reliability of Advanced Packaging
12小时前
待确认
Challenges and recent prospectives of 3D heterogeneous integration
6天前
已完结
Study of Fabrication and Reliability for the Extremely Large 2.5D Advanced Package
6天前
已完结
Overview of Thermal Modeling and Monitoring for SiC Multi-Chip Power Modules
24天前
已完结
A novel room-temperature surface Si3N4 patterned As+ ion implant solution to wafer warpagemodulation in 3D NAND flash fabrication
1个月前
已完结
Recent Advances and Trends in Advanced Packaging
1个月前
已完结
Package Warpage Reduction for Large CoWoS-R Packages
3个月前
已完结
How to Manipulate Warpage in Fan-out Wafer and Panel Level Packaging
3个月前
已完结
Ribbed package geometry for reducing thermal warpage and wire sweep during PBGA encapsulation
6个月前
已完结
液体压缩模具底部填充物设计用于包覆成型工艺中的一步封装
8个月前
已完结
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