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102 积分 2023-10-20 加入
Study of the Thermomechanical Performance of FR-4 Laminates During the Reflow Process
2个月前
已完结
Low-CTE, Strong-Adhesion, and High-Resolution Photosensitive Polyimide Materials for Advanced Packaging Applications: Structure and Properties
2个月前
已完结
Shrinkage stress of thermal cured epoxy resin reduced by addition of functional hollow microspheres
2个月前
已完结
Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study
1年前
已完结
Assembly of 43 diverse human Y chromosomes reveals extensive complexity and variation
1年前
已完结
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