Lv11
8 积分 2026-07-26 加入
Thermal-Mechanical Analysis and Optimization of Diamond Heat Sink Packaging for Enhancing GaN HEMT Performance
19分钟前
待确认
Chemical Vapor Deposition (CVD) Diamond-filled Through Vias for Enhanced Vertical Heat Transport in 3D Heterogeneous Integration
2小时前
已完结
Crystalline Interlayers for Reducing the Effective Thermal Boundary Resistance in GaN-on-Diamond
1个月前
已完结
Low Thermal Boundary Resistance Interfaces for GaN-on-Diamond Devices
1个月前
已完结
Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices
1个月前
已完结
Barrier-Layer Optimization for Enhanced GaN-on-Diamond Device Cooling
1个月前
已完结
Low Thermal Boundary Resistance Interfaces for GaN-on-Diamond Devices
1个月前
已完结
Reducing GaN-on-diamond interfacial thermal resistance for high power transistor applications
1个月前
已完结
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