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254 积分 2026-05-27 加入
Evolution of microstructure and residual stress for a lead-frame Cu-2.13Fe-0.026 P (wt%) alloy
15天前
已完结
Study on the thermal stability of Cu-14Fe in situ composite without and with trace Ag
15天前
已关闭
Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys
15天前
已完结
Influence of Ag micro-alloying on the thermal stability and ageing characteristics of a Cu–14Fe in-situ composite
15天前
已完结
Effect of Ag on the thermal stability of deformation processed Cu–Fe in situ composites
15天前
已完结
State of the art and prospects in sliver- and copper-matrix composite electrical contact materials
15天前
已完结
Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds
15天前
已完结
Nanoprecipitates induced dislocation pinning and multiplication strategy for designing high strength, plasticity and conductivity Cu alloys
15天前
已完结
Formation of large scaled zero-strain deformation twins in coarse-grained copper
15天前
已完结
High strength and high conductivity Cu alloys: A review
15天前
已完结
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