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264 积分 2026-04-23 加入
A Flexible and Electrically Conductive Liquid Metal Adhesive for Hybrid Electronic Integration
3个月前
已完结
Material innovation and mechanics design for substrates and encapsulation of flexible electronics: a review
3个月前
已完结
Deformation and damage properties of low temperature SnAgCu-Bi-Sb solder joints
3个月前
已完结
Triple-layered encapsulation through direct droplet impact
3个月前
已关闭
Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints
3个月前
已完结
Bump morphology formation and transformation mechanism in solder droplet printing
3个月前
已完结
Dual approach for high-efficiency graphene oxide reduction
3个月前
已完结
Fabrication and properties of Ni-modified graphene nanosheets reinforced Sn-Ag-Cu composite solder
3个月前
已完结
Effect of Ni-modified reduced graphene oxide on the mechanical properties of Sn–58Bi solder joints
3个月前
已完结
Properties enhancement of SnAgCu solders containing rare earth Yb
3个月前
已完结
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