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20 积分 2026-04-23 加入
Microstructure, hardness, electrical, and thermal conductivity of SZCN solder reinforced with TiO2 and ZrO2 nanoparticles fabricated by powder metallurgy method
1小时前
已完结
Size effects on IMC growth of Cu/Ni/Sn-3.5Ag microbump joints during isothermal aging and prediction of shear strength using ANN
1天前
已完结
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
27天前
已完结
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