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476 积分 2024-06-27 加入
Preparation of heat-resistant poly(amide-imide) films with ultralow coefficients of thermal expansion for optoelectronic application
3个月前
已完结
Effect of Diamine Monomers with Varied Backbone Structures on Dielectric and Other Comprehensive Properties of Fluorinated Polyimide Films
3个月前
已完结
Preparation of heat-resistant poly(amide-imide) films with ultralow coefficients of thermal expansion for optoelectronic application
3个月前
已完结
Synthesis and characterization of poly(amide-imide)s with high Tg and low CTE derived from isomeric amide-containing diamines
3个月前
已完结
Polyimide films with ultralow dielectric loss for 5G applications: Influence and mechanism of ester groups in molecular chains
3个月前
已完结
Investigation of the structure–dielectric relationship of polyimides with ultralow dielectric constant and dissipation factors using density functional theory
3个月前
已完结
Synthesis, properties, and molecular simulations of high‐barrier polyimide containing carbazole moiety and amide group in the main chain
3个月前
已完结
Synthesis, properties, and molecular simulations of high‐barrier polyimide containing carbazole moiety and amide group in the main chain
3个月前
已完结
Super-heat resistant, transparent and low dielectric polyimides based on spirocyclic bisbenzoxazole diamines with Tg > 450 °C
4个月前
已完结
Near-Zero Thermal Expansion and High Heat-Resistance Polyimide Films Based on a Symmetric and Rigid Pyrazine Structure
4个月前
已完结
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